Apparatus and method for extended cache correction

ABSTRACT

An apparatus includes a semiconductor fuse array, a cache memory, and a plurality of cores. The semiconductor fuse array is disposed on a die, into which is programmed the configuration data. The semiconductor fuse array has a first plurality of semiconductor fuses that is configured to store compressed cache correction data. The a cache memory is disposed on the die. The plurality of cores is disposed on the die, where each of the plurality of cores is coupled to the semiconductor fuse array and the cache memory, and is configured to access the semiconductor fuse array upon power-up/reset, to decompress the compressed cache correction data, and to distribute decompressed cached correction data to initialize the cache memory.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of the following U.S PatentApplication.

Ser. FILING No. DATE TITLE 13,972,785 Aug. 21, 2013 MICROPROCESSORMECHANISM (VAS.2700) FOR DECOMPRESSION OF CACHE CORRECTION DATA

This application is related to the following co-pending U.S. PatentApplications, each of which has a common assignee and common inventors.

Ser. FILING No. DATE TITLE 14,635,006 Mar. 2, 2015 APPARATUS AND METHODFOR (VAS.2700-C1) STORAGE AND DECOM- PRESSION OF CONFIGURATION DATA14,635,026 Mar. 2, 2015 MULTI-CORE FUSE DE- (VAS.2700-C2) COMPRESSIONMECHANISM 14,635,040 Mar. 2, 2015 EXTENDED FUSE RE- (VAS.2700-C3)PROGRAMMABILITY MECHANISM 14,635,090 Mar. 2, 2015 CORE-SPECIFIC FUSEMECHANISM (VAS.2700-C5) FOR A MULTI-CORE DIE 14,635,113 Mar. 2, 2015APPARATUS AND METHOD FOR (VAS.2700-C6) CONFIGURABLE REDUNDANT FUSE BANKS14,635,933 Mar. 2, 2015 APPARATUS AND METHOD (VAS.2700-C7) FOR RAPIDFUSE BANK ACCESS IN A MULTI-CORE PROCESSOR 14,635,969 Mar. 2, 2015MULTI-CORE MICRO- (VAS.2700-C8) PROCESSOR CONFIGURATION DATA COMPRESSIONAND DE- COMPRESSION SYSTEM 14,635,990 Mar. 2, 2015 APPARATUS AND METHODFOR (VAS.2700-C9) COMPRESSION OF CONFIGURATION DATA 13,972,768 Aug. 21,2013 MICROPROCESSOR MECHANISM (VAS.2699) FOR DECOMPRESSION OF FUSECORRECTION DATA 13,972,785 Aug. 21, 2013 MICROPROCESSOR MECHANISM(VAS.2700) FOR DECOMPRESSION OF CACHE CORRECTION DATA 13,972,794 Aug.21, 2013 APPARATUS AND METHOD FOR (VAS.2705) COMPRESSION AND DE-COMPRESSION OF MICROPROCESSOR CONFIGURATION DATA 13,972,812 Aug. 21,2013 CORRECTABLE CONFIGURATION (VAS.2706) DATA COMPRESSION ANDDECOMPRESSION SYSTEM

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates in general to the field of microelectronics, andmore particularly to apparatus and methods for providing compressedconfiguration data in a fuse array associated with a multi-core device.

2. Description of the Related Art

Integrated device technologies have exponentially advanced over the past40 years. More specifically directed to the microprocessor fields,starting with 4-bit, single instruction, 10-micrometer devices, theadvances in semiconductor fabrication technologies have enableddesigners to provide increasingly more complex devices in terms ofarchitecture and density. In the 80's and 90's so-called pipelinemicroprocessors and superscalar microprocessors were developedcomprising millions of transistors on a single die. And now 20 yearslater, 64-bit, 32-nanometer devices are being produced that havebillions of transistors on a single die and which comprise multiplemicroprocessor cores for the processing of data.

One requirement that has persisted since these early devices wereproduced is the need to initialize these devices with configuration datawhen they are turned on or when they are reset. For example, manyarchitectures enable devices to be configured to execute at one of manyselectable frequencies and/or voltages. Other architectures require thateach device have a serial number and other information that can be readvia execution of an instruction. Yet other devices requireinitialization data for internal registers and control circuits. Stillother devices utilize configuration data to implement redundant circuitswhen primary circuits are fabricated in error or outside of marginalconstraints.

As one skilled in the art will appreciate, designers have traditionallyemployed semiconductor fuse arrays on-die to store and provide initialconfiguration data. These fuse arrays are generally programmed byblowing selected fuses therein after a part has been fabricated and thearrays contain thousands of bits of information which is read by itscorresponding device upon power-up/reset to initialize and configure thedevice for operation.

As device complexity has increase over the past years, the amount ofconfiguration data that is required for a typical device hasproportionately increased. Yet, as one skilled in the art willappreciate, though transistor size shrinks in proportion to thesemiconductor fabrication process employed, semiconductor fuse sizeincreases to the unique requirements for programming fuses on die. Thisphenomenon, in and of itself, is a problem for designers, who areprevalently constrained by real estate and power considerations. Thatis, there is just not enough real estate on a given die to fabricate ahuge fuse array.

In addition, the ability to fabricate multiple device cores on a singledie has geometrically exacerbated the problem, because configurationrequirements for each of the cores results in requirement for a numberof fuses on die, in a single array or distinct arrays, that are equal tothe number of cores disposed thereon.

Therefore, what is needed is apparatus and methods that enableconfiguration data to be stored and provided to a multi-core device thatrequire significantly less real estate and power on a single die thanthat which has heretofore been provided.

In addition, what is needed is a fuse array mechanism that can store andprovide significantly more configuration data than current techniqueswhile requiring the same or less real estate on a multi-core die.

SUMMARY OF THE INVENTION

The present invention, among other applications, is directed to solvingthe above-noted problems and addresses other problems, disadvantages,and limitations of the prior art by providing a superior technique forutilizing compressed configuration data in a fuse array associated witha multi-core device. In one embodiment, an apparatus is contemplated forproviding configuration data to an integrated circuit. The apparatusincludes a semiconductor fuse array, a cache memory, and a plurality ofcores. The semiconductor fuse array is disposed on a die, into which isprogrammed the configuration data. The semiconductor fuse array has afirst plurality of semiconductor fuses that is configured to storecompressed cache correction data. The a cache memory is disposed on thedie. The plurality of cores is disposed on the die, where each of theplurality of cores is coupled to the semiconductor fuse array and thecache memory, and is configured to access the semiconductor fuse arrayupon power-up/reset, to decompress the compressed cache correction data,and to distribute decompressed cached correction data to initialize thecache memory.

One aspect of the present invention contemplates an apparatus forproviding configuration data to an integrated circuit. The apparatusincludes a multi-core microprocessor. The multi-core microprocessor hasa semiconductor fuse array, disposed on a die, into which is programmedthe configuration data. The semiconductor fuse array has a firstplurality of semiconductor fuses configured to store compressed cachecorrection data. The multi-core microprocessor also has a cache memory,disposed on the die and a plurality of cores, disposed on the die, whereeach of the plurality of cores is coupled to the semiconductor fusearray and the cache memory, and is configured to access thesemiconductor fuse array upon power-up/reset, to decompress thecompressed cache correction data, and to distribute decompressed cachedcorrection data to initialize the cache memory.

Another aspect of the present invention contemplates a method forproviding configuration data to an integrated circuit. The methodincludes first disposing a semiconductor fuse array on a die. The firstdisposing includes storing compressed cache correction data in a firstplurality of semiconductor fuses. The method also includes seconddisposing a cache memory on the die; and also includes third disposing aplurality of cores on the die, where each of the plurality of cores iscoupled to the semiconductor fuse array and the cache memory; The methodfurther includes, via each of the plurality of cores, accessing thesemiconductor fuse array upon power-up/reset, decompressing thecompressed cache correction data, and distributing decompressed cachedcorrection data to initialize the cache memory.

Regarding industrial applicability, the present invention is implementedwithin a MICROPROCESSOR which may be used in a general purpose orspecial purpose computing device.

BRIEF DESCRIPTION OF THE DRAWINGS

These and other objects, features, and advantages of the presentinvention will become better understood with regard to the followingdescription, and accompanying drawings where:

FIG. 1 is a block diagram illustrating a present day microprocessor corethat includes a fuse array for providing configuration data to themicroprocessor core;

FIG. 2 is a block diagram depicting a fuse array within themicroprocessor core of FIG. 1 which includes redundant fuse banks thatmay be blown subsequent to blowing first fuse banks within the fusearray;

FIG. 3 is a block diagram featuring a system according to the presentinvention that provides for compression and decompression ofconfiguration data for a multi-core device;

FIG. 4 is a block diagram showing a fuse decompression mechanismaccording to the present invention;

FIG. 5 is a block diagram illustrating an exemplary format forcompressed configuration data according to the present invention;

FIG. 6 is a block diagram illustrating an exemplary format fordecompressed microcode patch configuration data according to the presentinvention;

FIG. 7 is a block diagram depicting an exemplary format for decompressedmicrocode register configuration data according to the presentinvention;

FIG. 8 is a block diagram featuring an exemplary format for decompressedcache correction data according to the present invention;

FIG. 9 is a block diagram showing an exemplary format for decompressedfuse correction data according to the present invention;

FIG. 10 is a block diagram illustrating configurable redundant fusearrays in a multi-core device according to the present invention;

FIG. 11 is a block diagram detailing a mechanism according to thepresent invention for rapidly loading configuration data into amulti-core device; and

FIG. 12 is a block diagram showing an error checking and correctionmechanism according to the present invention.

DETAILED DESCRIPTION

Exemplary and illustrative embodiments of the invention are describedbelow. In the interest of clarity, not all features of an actualimplementation are described in this specification, for those skilled inthe art will appreciate that in the development of any such actualembodiment, numerous implementation specific decisions are made toachieve specific goals, such as compliance with system-related andbusiness related constraints, which vary from one implementation to thenext. Furthermore, it will be appreciated that such a development effortmight be complex and time-consuming, but would nevertheless be a routineundertaking for those of ordinary skill in the art having the benefit ofthis disclosure. Various modifications to the preferred embodiment willbe apparent to those skilled in the art, and the general principlesdefined herein may be applied to other embodiments. Therefore, thepresent invention is not intended to be limited to the particularembodiments shown and described herein, but is to be accorded the widestscope consistent with the principles and novel features hereindisclosed.

The present invention will now be described with reference to theattached figures. Various structures, systems, and devices areschematically depicted in the drawings for purposes of explanation onlyand so as to not obscure the present invention with details that arewell known to those skilled in the art. Nevertheless, the attacheddrawings are included to describe and explain illustrative examples ofthe present invention. The words and phrases used herein should beunderstood and interpreted to have a meaning consistent with theunderstanding of those words and phrases by those skilled in therelevant art. No special definition of a term or phrase (i.e., adefinition that is different from the ordinary and customary meaning asunderstood by those skilled in the art) is intended to be implied byconsistent usage of the term or phrase herein. To the extent that a termor phrase is intended to have a special meaning (i.e., a meaning otherthan that understood by skilled artisans) such a special definition willbe expressly set forth in the specification in a definitional mannerthat directly and unequivocally provides the special definition for theterm or phrase.

In view of the above background discussion on device fuse arrays andassociated techniques employed within present day integrated circuitsfor providing configuration data during initial power-up, a discussionof the limitations and disadvantages of those techniques will bepresented with reference to FIGS. 1-2. Following this, a discussion ofthe present invention will be presented with reference to FIGS. 3-12.The present invention overcomes all of the limitations and disadvantagesdiscussed below by providing apparatus and methods for employingcompressed configuration in a multi-core die which utilize less powerand real estate on the multi-core die, and which are more reliable thanthat which has heretofore been provided.

Definitions

Integrated Circuit (IC): A set of electronic circuits fabricated on asmall piece of semiconductor material, typically silicon. An IC is alsoreferred to as a chip, a microchip, or a die.

Central Processing Unit (CPU): The electronic circuits (i.e.,“hardware”) that execute the instructions of a computer program (alsoknown as a “computer application” or “application”) by performingoperations on data that include arithmetic operations, logicaloperations, and input/output operations.

Microprocessor: An electronic device that functions as a CPU on a singleintegrated circuit. A microprocessor receives digital data as input,processes the data according to instructions fetched from a memory(either on-die or off-die), and generates results of operationsprescribed by the instructions as output. A general purposemicroprocessor may be employed in a desktop, mobile, or tablet computer,and is employed for uses such as computation, text editing, multimediadisplay, and Internet browsing. A microprocessor may also be disposed inan embedded system to control a wide variety of devices includingappliances, mobile telephones, smart phones, and industrial controldevices.

Multi-Core Processor: Also known as a multi-core microprocessor, amulti-core processor is a microprocessor having multiple CPUs (“cores”)fabricated on a single integrated circuit.

Instruction Set Architecture (ISA) or Instruction Set: A part of acomputer architecture related to programming that includes data types,instructions, registers, addressing modes, memory architecture,interrupt and exception handling, and input/output. An ISA includes aspecification of the set of opcodes (i.e., machine languageinstructions), and the native commands implemented by a particular CPU.

x86-Compatible Microprocessor: A microprocessor capable of executingcomputer applications that are programmed according to the x86 ISA.

Microcode: A term employed to refer to a plurality of microinstructions. A micro instruction (also referred to as a “nativeinstruction”) is an instruction at the level that a microprocessorsub-unit executes. Exemplary sub-units include integer units, floatingpoint units, MMX units, and load/store units. For example, microinstructions are directly executed by a reduced instruction set computer(RISC) microprocessor. For a complex instruction set computer (CISC)microprocessor such as an x86-compatible microprocessor, x86instructions are translated into associated micro instructions, and theassociated micro instructions are directly executed by a sub-unit orsub-units within the CISC microprocessor.

Fuse: A conductive structure typically arranged as a filament which canbe broken at select locations by applying a voltage across the filamentand/or current through the filament. Fuses may be deposited at specifiedareas across a die topography using well known fabrication techniques toproduce filaments at all potential programmable areas. A fuse structureis blown (or unblown) subsequent to fabrication to provide for desiredprogrammability of a corresponding device disposed on the die.

Turning to FIG. 1, a block diagram 100 is presented illustrating apresent day microprocessor core 101 that includes a fuse array 102 forproviding configuration data to the microprocessor core 101. The fusearray 102 comprises a plurality of semiconductor fuses (not shown)typically arranged in groups known as banks. The fuse array 102 iscoupled to reset logic 103 that includes both reset circuits 104 andreset microcode 105. The reset logic 103 is coupled to control circuits107, microcode registers 108, microcode patches elements 109, and cachecorrection elements 110. An external reset signal RESET is coupled tothe microprocessor core 101 and is routed to the reset logic 103.

As one skilled in the art will appreciate, fuses (also called “links” or“fuse structures”) are employed in a vast number of present dayintegrated circuit devices to provide for configuration of the devicesafter the devices have been fabricated. For example, consider that themicroprocessor core 101 of FIG. 1 is fabricated to provide functionalityselectively either as a desktop device or a mobile device. Accordingly,following fabrication, prescribed fuses within the fuse array 102 may beblown to configure the device as, say, a mobile device. Accordingly,upon assertion of RESET, the reset logic 103 reads the state of theprescribed fuses in the fuse array 102 and the reset circuits 104(rather than reset microcode 105, in this example) enable correspondingcontrol circuits 107 that deactivate elements of the microprocessor core101 exclusively associated with desktop operations and activate elementsof the microprocessor core 101 exclusively associated with mobileoperations. Consequently, the microprocessor core 101 is configured uponpower-up reset as a mobile device. In addition, the reset logic 103reads the state of the other fuses in the fuse array 102 and the resetcircuits 104 (rather than reset microcode 105, in this example) enablecorresponding cache correction elements 110 provide correctivemechanisms for one or more cache memories associated (not shown) withthe microprocessor core 101. Consequently, the microprocessor core 101is configured upon power-up reset as a mobile device and correctivemechanisms for its cache memories are in place.

The above example is merely one of many different uses for configurationfuses in an integrated circuit device such as a microprocessor core 101of FIG. 1. One skilled in the art will appreciate that other uses forconfiguration fuses include, but are not limited to, configuration ofdevice specific data (e.g., serial numbers, unique cryptographic keys,architecture mandated data that can be accessed by users, speedsettings, voltage settings), initialization data, and patch data. Forexample, many present day devices execute microcode and often requireinitialization of microcode registers 108 that are read by themicrocode. Such initialization data may be provided by microcoderegister fuses (not shown) within the fuse array 102, which are readupon reset and provided to the microcode registers 108 by the resetlogic 103 (using either the reset circuits 104, the reset microcode 105,or both elements 104-105). For purposes of the present application, thereset circuits 104 comprise hardware elements that provide certain typesof configuration data, which cannot be provided via the execution of thereset microcode 105. The reset microcode 105 comprises a plurality ofmicro instructions disposed within an internal microcode memory (notshown) that is executed upon reset of the microprocessor core 101 toperform functions corresponding to initialization of the microprocessorcore 101, those functions including provision of configuration data thatis read from the fuse array 102 to elements such as microcode registers108 and microcode patch mechanisms 109. The criteria for whether certaintypes of configuration data provided via fuses can be distributed to thevarious elements 107-110 in the microprocessor core 101 via resetmicrocode 105 or not is a function primarily of the specific design ofthe microprocessor core 101. It is not the intent of the presentapplication to provide a comprehensive tutorial on specificconfiguration techniques that are employed to initialize integratedcircuit devices, for one skilled in the art will appreciate that for apresent day microprocessor core 101 the types of configurable elements107-110 generally fall into four categories as are exemplified in FIG.1: control circuits, microcode registers, microcode patch mechanisms,and cache correction mechanisms. Furthermore, one skilled willappreciate that the specific values of the configuration datasignificantly vary based upon the specific type of data. For instance, a64-bit control circuit 107 may include ASCII data that prescribes aserial number for the microprocessor 101. Another 64-bit controlregister may have 64 different speed settings, only one of which isasserted to specify an operating speed for the microprocessor core 101.Microcode registers 108 may typically be initialized to all zeroes (i.e.logic low states) or to all ones (i.e., logic high states). Microcodepatch mechanisms 109 may include an approximately uniform distributionof ones and zeroes to indicate addresses in a microcode ROM (not shown)along with replacement microcode values for those addresses. Finally,cache correction mechanisms may comprise very sparse settings of ones toindicate substitution control signals to replace a certain cachesub-bank element (i.e., a row or a column) with a particular replacementsub-bank element.

Fuse arrays 102 provide an excellent means for configuring a device suchas the microprocessor core 101 subsequent to fabrication of the device.By blowing selected fuses in the fuse array 102, the microprocessor core101 can be configured for operation in its intended environment. Yet, asone skilled in the art will appreciate, operating environments maychange following programming of the fuse array 102. Businessrequirements may dictate that microprocessor core 101 originallyconfigured as, say, as a microprocessor core 101 for a desktop device,be reconfigured as a microprocessor core 101 for a mobile device.Accordingly, designers have provided techniques that utilize redundantbanks of fuses within the fuse array 102 to provide for “unblowing”selected fuses therein, thus enabling the microprocessor core 101 to bereconfigured, fabrication errors to be corrected, and etc. Theseredundant array techniques will now be discussed with reference to FIG.2.

Referring now to FIG. 2, a block diagram 200 is presented depicting afuse array 201 within the microprocessor core 101 of FIG. 1 includingredundant fuse banks 202 RFB1-RFBN that that may be blown subsequent toblowing first fuse banks 202 PFB1-PFBN within the fuse array 201. Eachof the fuse banks 202 PFB1-PFBN, RFB1-RFBN comprises a prescribed numberof individual fuses 203 corresponding to specific design of themicroprocessor core 101. For example, the number of fuses 203 in a givenfuse bank 202 may be 64 fuses 203 in a 64-bit microprocessor core 101 tofacilitate provision of configuration data in a format that is easilyimplemented in the microprocessor core 101.

The fuse array 201 is coupled to a set of registers 210-211 that aretypically disposed within reset logic in the microprocessor core 101. Aprimary register PR1 is employed to read one of the first fuse banksPFB1-PFBN (say, PFB3 as is shown in the diagram 200) and a redundantregister RR1 is employed to read a corresponding one of the redundantfuse banks RFB1-RFBN. The registers 210-211 are coupled to exclusive-ORlogic 212 that generates an output FB3.

In operation, subsequent to fabrication of the microprocessor core 101,the first fuse banks PFB1-PFBN are programmed by known techniques withconfiguration data for the microprocessor core 101. The redundant fusebanks RFB1-RFBN are not blown and remain at a logic low state for allfuses therein. Upon power-up/reset of the microprocessor core 101, boththe first fuse banks PFB1-PFBN and the redundant fuse banks RFB1-RFBNare read as required for configuration into the primary and redundantregisters 210-211, respectively. The exclusive-OR logic 212 generatesthe output FB3 that is a logical exclusive-OR result of the contents ofthe registers 210-211. Since all of the redundant fuse banks are unblown(i.e., logic low states), the output FB3 value is simply that which wasprogrammed into the first fuse banks PFB1-PFBN subsequent tofabrication.

The mechanism of FIG. 2 may be employed to provide for “reblow” of fuses203 within the microprocessor core 101, but as one skilled in the artwill appreciate, a given fuse 203 may only be reblown one time as thereis only one set of redundant fuse banks RFB1-RFBN. To provide foradditional reblows, a corresponding number of additional fuse banks 202and registers 210-211 must be added to the microprocessor core 101.

Heretofore, the fuse array mechanisms as discussed above with referenceto FIGS. 1-2 has provided enough flexibility to sufficiently configuremicroprocessor cores and other related devices, while also allowing fora limited number of reblows. This is primarily due to the fact thatformer fabrication technologies, say 65 nanometer and 45 nanometerprocesses, allow ample real estate on a die for the implementation ofenough fuses to provide for configuration of a microprocessor core 101disposed on the die. However, the present inventors have observed thatpresent day techniques are limited going forward due to two significantfactors. First, the trend in the art is to dispose multiple devicemicroprocessor cores 101 on a single die to increase processingperformance. These so-called multi-core devices may include, say, 2-16individual microprocessor cores 101, each of which must be configuredwith fuse data upon power-up/reset. Accordingly, for a 4-core device,four fuse arrays 201 are required in that some of the data associatedwith individual microprocessor cores may vary (e.g., cache correctiondata, redundant fuse data, etc.). Secondly, as one skilled in the artwill appreciate, as fabrication process technologies shrink to, say, 32nanometers, while transistor size shrinks accordingly, fuse sizeincreases, thus requiring more die real estate to implement the samesize fuse array on a 32-nanometer die opposed to that on a 45-nanometerdie.

Both of the above limitations, and others, pose significant challengesto device designers, and more specifically to multi-core devicedesigners, and the present inventors note that significant improvementsover conventional device configuration mechanisms can be implemented inaccordance with the present invention, which allows for programming ofindividual cores in a multi-core device along with substantial increasesin cache correction and fuse reprogramming (“reblow”) elements. Thepresent invention will now be discussed with reference to FIGS. 3-12.

Turning to FIG. 3, a block diagram is presented featuring a system 300according to the present invention that provides for compression anddecompression of configuration data for a multi-core device. Themulti-core device comprises a plurality of microprocessor cores 332disposed on a die 330. For illustrative purposes, four cores 332 CORE1-CORE 4 are depicted on the die 330, although the present inventioncontemplates various numbers of cores 332 disposed on the die 330. Inone embodiment, all the microprocessor core 332 share a single cachememory 334 that is also disposed on the die 330. A fuse array 336 isalso disposed on the die 330 and each of the microprocessor cores 332are configured to access the fuse array 336 to retrieve and decompressconfiguration data as described above during power-up/reset.

In one embodiment, the microprocessor core 332 comprise microprocessorcores configured as a multi-core microprocessor disposed on the die 330.In another embodiment, the multi-core microprocessor is configured as anx86-compatible multi-core microprocessor. In yet another embodiment, thecache 334 comprises a level 2 (L2) cache 334 associated with themicroprocessor cores 332. In one embodiment, the fuse array 336comprises 8192 (8K) individual fuses (not shown), although other numbersof fuses are contemplated. In a single-core embodiment, only one core332 is disposed on the die 330 and the core 332 is coupled to the cache334 and fuse array 336. The present inventors note that althoughfeatures and functions of the present invention will henceforth bediscussed in the context of a multi-core device disposed on the die 330,these features and functions are equally applicable to a single-coreembodiment as well.

The system 300 also includes a device programmer 310 that includes acompressor 320 that is coupled to a virtual fuse array 303. In oneembodiment, the device programmer 310 may comprise a CPU (not shown)that is configured to process configuration data and to program the fusearray 336 following fabrication of the die 330 according to well knownprogramming techniques. The CPU may be integrated into a wafer testapparatus that is employed to test the die 330 following fabrication. Inone embodiment, the compressor 320 may comprise an application programthat executes on the device programmer 310 and the virtual fuse array303 may comprise locations within a memory that is accessed by thecompressor 320. The virtual fuse array 303 includes a plurality ofvirtual fuse banks 301, that each comprise a plurality of virtual fuses302. In one embodiment the virtually fuse array 303 comprises 128virtual fuse banks 301 that each comprise 64 virtual fuses 302,resulting in a virtual fuse array 303 that is 8 Kb in size.

Operationally, configuration information for the die 330 is entered intothe virtual fuse array 303 as part of the fabrication process, and as isdescribed above with reference to FIG. 1. Accordingly, the configurationinformation comprises control circuits configuration data,initialization data for microcode registers, microcode patch data, andcache correction data. Further, as described above, the distributions ofvalues for associated with each of the data types is substantiallydifferent from type to type. The virtual fuse array 303 is a logicalrepresentation of a fuse array (not shown) that comprises configurationinformation for each of the microprocessor cores 332 on the die 330 andcorrection data for each of the caches 334 on the die 330.

After the information is entered into the virtual fuse array 303, thecompressor 320 reads the state of the virtual fuses 302 in each of thevirtual fuse banks 301 and compresses the information using distinctcompression algorithms corresponding to each of the data types to rendercompressed fuse array data within the virtual fuse array 303. In oneembodiment, system data for control circuits is not compressed, butrather is transferred without compression. To compress microcoderegister data, a microcode register data compression algorithm isemployed that is effective for compressing data having a statedistribution that corresponds to the microcode register data. Tocompress microcode patch data, a microcode patch data compressionalgorithm is employed that is effective for compressing data having astate distribution that corresponds to the microcode patch data. Tocompress cache correction data, a cache correction data compressionalgorithm is employed that is effective for compressing data having astate distribution that corresponds to the cache correction data.

The device programmer 310 then programs the uncompressed and compressedfuse array data into the fuse array 336 on the die 330.

Upon power-up/reset, each of the microprocessor cores 332 may access thefuse array 336 to retrieve the uncompressed and compressed fuse arraydata, and reset circuits/microcode (not shown) disposed within each ofthe microprocessor cores 332 distributes the uncompressed fuse arraydata and decompresses the compressed fuse array data according todistinct decompression algorithms corresponding to each of the datatypes noted above to render values originally entered into the virtualfuse array 303. The reset circuits/microcode then enter theconfiguration information into control circuits (not shown), microcoderegisters (not shown), patch elements (not shown), and cache correctionelements (not shown).

Advantageously, the fuse array compression system 300 according to thepresent invention enables device designers to employ substantially fewernumbers of fuses in a fuse array 336 over that which has heretofore beenprovided, and to utilize the compressed information programmed thereinto configure a multi-core device disposed on the die disposed on the die330 during power-up/reset.

Turning now to FIG. 4, a block diagram 400 is presented showing a fusedecompression mechanism according to the present invention. Thedecompression mechanism may be disposed within each of themicroprocessor cores 332 of FIG. 3. For purposes of clearly teaching thepresent invention, only one core 420 is depicted in FIG. 4 and each ofthe microprocessor cores 332 disposed on the die comprise substantiallyequivalent elements as the core 420 shown. A physical fuse array 401disposed on the die as described above is coupled to the core 420. Thephysical fuse array 401 comprises compressed microcode patch fuses 403,compressed register fuses 404, compressed cache correction fuses 405,and compressed fuse correction fuses 406. The physical fuse array 401may also comprise uncompressed configuration data (not shown) such assystem configuration data as discussed above and/or block error checkingand correction (ECC) codes (not shown). The inclusion of ECC featuresaccording to the present invention will be discussed in further detailbelow.

The microprocessor core 420 comprises a reset controller 417 thatreceives a reset signal RESET which is asserted upon power-up of thecore 420 and in response to events that cause the core 420 to initiate areset sequence of steps. The reset controller 417 includes adecompressor 421. The decompressor 421 has a patch fuses element 408, aregister fuses element 409, and a cache fuses element 410. Thedecompressor also comprises a fuse correction element 411 that iscoupled to the patch fuses element 408, the register fuses element 409,and the cache fuses element 410 via bus 412. The patch fuses element 408is coupled to microcode patch elements 414 in the core 420. The registerfuses element 409 is coupled to microcode registers 415 in the core 420.And the cache fuses element 410 is coupled to cache correction elements416 in the core 420. In one embodiment, the cache correction elements416 are disposed within an on-die L2 cache (not shown) that is shared byall the cores 420, such as the cache 334 of FIG. 3. Another embodimentcontemplates cache correction elements 416 disposed within an L1 cache(not shown) within the core 420. A further embodiment considers cachecorrection elements 416 disposed to correct both the L2 and L1 cachesdescribed above.

In operation, upon assertion of RESET the reset controller 417 reads thestates of the fuses 403-406 in the physical fuse array 401 anddistributes the states of the fuses 403-406 to the decompressor 421.After the fuse data has been read and distributed, the fuse correctionelement 411 of the decompressor 421 decompresses the compressed fusecorrection fuses states to render data that indicates one or more fuseaddresses in the physical fuse array 401 whose states are to be changedfrom that which was previously programmed. The data may also include avalue for each of the one or more fuse addresses. The one or more fuseaddresses (and optional values) are routed via bus 412 to the elements408-410 so that the states of corresponding fuses processed therein arechanged prior to decompression of their corresponding compressed data.

In one embodiment, the patch fuses element 408 comprises microcode thatoperates to decompress the states of the compressed microcode patchfuses 403 according to a microcode patch decompression algorithm thatcorresponds the microcode patch compression algorithm described abovewith reference to FIG. 3. In one embodiment, the register fuses element409 comprises microcode that operates to decompress the states of thecompressed register fuses 404 according to a register fusesdecompression algorithm that corresponds to the register fusescompression algorithm described above with reference to FIG. 3. In oneembodiment, the cache fuses element 410 comprises microcode thatoperates to decompress the states of the compressed cache correctionfuses 405 according to a cache correction fuses decompression algorithmthat corresponds to the cache correction fuses compression algorithmdescribed above with reference to FIG. 3. After each of the elements408-410 change the states of any fuses whose addresses (and optionalvalues) are provided via bus 412 from the fuse correction element 411,their respective data is decompressed according to the correspondingalgorithm employed. As will be described in further detail below, thepresent invention contemplates multiple “reblows” of any fuse addresswithin the physical fuse array prior to the initiation of thedecompression process executed by any of the decompressors 408-411. Inone embodiment bus 412 may comprise conventional microcode programmingmechanisms that are employed to transfer data between respectiveroutines therein. The present invention further contemplates acomprehensive decompressor 421 having capabilities to recognize anddecompress configuration data based upon its specific type. Accordingly,the recited elements 408-411 within the decompressor 421 are presentedin order to teach relevant aspects of the present invention, however,contemplated implementations of the present invention may notnecessarily include distinct elements 408-411, but rather acomprehensive decompressor 421 that provides functionality correspondingto each of the elements 408-411 discussed above.

In one embodiment, the reset controller 417 initiates execution ofmicrocode within the patch fuses element 408 to decompress the states ofthe compressed microcode patch fuses 403. The reset controller 417 alsoinitiates execution of microcode within the register fuses element 409to decompress the states of the compressed register fuses 404. And thereset controller 417 further initiates execution of microcode within thecache fuses element 410 to decompress the states of the compressed cachecorrection fuses 405. The microcode within the decompressor 421 alsooperates to change the states of any fuses addressed by fuse correctiondata provided by the compressed fuse correction fuses 406 prior todecompression of the compressed data.

The reset controller 417, decompressor 421, and elements 408-411 thereinaccording to the present invention are configured to perform thefunctions and operations as discussed above. The reset controller 417,decompressor 421, and elements 408-411 therein may comprise logic,circuits, devices, or microcode, or a combination of logic, circuits,devices, or microcode, or equivalent elements that are employed toexecute the functions and operations according to the present inventionas noted. The elements employed to accomplish these operations andfunctions within the reset controller 417, decompressor 421, andelements 408-411 therein may be shared with other circuits, microcode,etc., that are employed to perform other functions and/or operationswithin the reset controller 417, decompressor 421, and elements 408-411therein or with other elements within the core 420.

After the states of the fuses 403-406 within the physical fuse array 401have been changed and decompressed, the states of the decompressed“virtual” fuses are then routed, as appropriate to the microcode patchelements 414, the microcode registers 415, and the cache correctionelements 416. Accordingly, the core 420 is configured for operationfollowing completion of a reset sequence.

The present inventors note that the decompression functions discussedabove need not necessarily be performed in a particular order during areset sequence. For example, microcode patches may be decompressedfollowing decompression of microcode registers initialization data.Likewise, the decompression functions may be performed in parallel or inan order suitable to satisfy design constraints.

Furthermore, the present inventors note that the implementations of theelements 408-411 need not necessarily be implemented in microcode versushardware circuits, since in a typical microprocessor core 420 thereexist elements of the core 420 which can more easily be initialized viahardware (such as a scan chain associated with a cache) as opposed todirect writes by microcode. Such implementation details are left up todesigner judgment. However, the present inventors submit that the priorart teaches that cache correction fuses are conventionally read andentered into a cache correction scan chain by hardware circuits duringreset prior to initiating the execution of microcode, and it is afeature of the present invention to implement the cache fusesdecompressor 410 in microcode as opposed to hardware control circuitssince a core's caches are generally not turned on until microcode runs.By utilizing microcode to implement the cache fuses element 410, a moreflexible and advantageous mechanisms is provided for entering cachecorrection data into a scan chain, and significant hardware is saved.

Now referring to FIG. 5, a block diagram is presented illustrating anexemplary format 500 for compressed configuration data 500 according tothe present invention. The compressed configuration data 500 iscompressed by the compressor 320 of FIG. 3 from data residing in thevirtual fuse array 303 and is programmed (i.e., “blown”) into the fusearray 336 of the multi-core device 330. During a reset sequence, as isdescribed above, the compressed configuration data 500 is retrieved fromthe fuse array 336 by each of the cores 332 and is decompressed andcorrected by the elements 408-411 of the decompressor 421 within each ofthe cores 420. The decompressed and corrected configuration data is thenprovided to the various elements 414-416 within the core 420 toinitialize the core 420 for operation.

The compressed configuration data 500 comprises one or more compresseddata fields 502 for each of the configuration data types discussed aboveand are demarcated by end-of-type fields 503. Programming events (i.e.,“blows”) are demarcated by an end-of-blow field 504. The compressed datafields 502 associated with each of the data types are encoded accordingto a compression algorithm that is optimized to minimize the number ofbits (i.e., fuses) that are required to store the particular bitpatterns associated with each of the data types. The number of fuses inthe fuse array 336 that make up each of compressed data fields 502 is afunction of the compression algorithm that is employed for a particulardata type. For example, consider a core that comprises sixty-four 64-bitmicrocode registers which must be initialized to, say, all ones or allzeroes. An optimum compression algorithm may be employed to yield 64compressed data fields 502 for that data type, where each of thecompressed data fields 502 comprises initialization data for aparticular microcode register where the compressed data fields 502 areprescribed in register number order (i.e., 1-64). And each of thecompressed data fields 502 comprises a single fuse which is blown if acorresponding microcode register is initialized to all ones, and whichis not blown if the corresponding microcode register is initialized toall zeroes.

The elements 408-410 of the decompressor 421 in the core 420 areconfigured to utilize the end-of-type fields 503 to determine wheretheir respective compressed data is located within the fuse array 336and the fuse correction decompressor 411 is configured to utilize theend-of-blow fields 504 to locate compressed fuse correction data thathas been programmed (i.e., blown) subsequent to an initial programmingevent. It is a feature of the present invention to provide a substantialamount of spare fuses in the fuse array 336 to allow for a significantnumber of subsequent programming events, as will be discussed in moredetail below.

The exemplary compressed type format discussed above is presented toclearly teach aspects of the present invention that are associated withcompression and decompression of configuration data. However, the mannerin which specific type data is compressed, demarcated, and the numberand types of data to be compressed within the physical fuse array 401 isnot intended to be restricted to the example of FIG. 5. Other numbers,types, and formats are contemplated that allow for tailoring of thepresent invention to various devices and architectures extant in theart.

Turning now to FIG. 6, a block diagram is presented illustrating anexemplary format for decompressed microcode patch configuration data 600according to the present invention. During a reset sequence, compressedmicrocode patch configuration data is read by each core 420 from thephysical fuse array 401. The compressed microcode patch configurationdata is then corrected according to fuse correction data provided viabus 412. Then, the corrected compressed microcode patch configurationdata is decompressed by the patch fuses decompressor 408. The result ofthe decompression process is the decompressed microcode patchconfiguration data 600. The data 600 comprises a plurality ofdecompressed data blocks 604 corresponding to the number of microcodepatch elements 414 within the core 420 that require initialization data.Each decompressed data block 604 comprises a core address field 601, amicrocode ROM address field 602, and a microcode patch data field 603.The sizes of the fields 601-603 are a function of the core architecture.As part of the decompression process, the patch fuses decompressor 408creates a complete image of the target data required to initialize themicrocode patch elements 414. Following decompression of the microcodepatch configuration data 600, conventional distribution mechanisms maybe employed to distribute the data 603 to respectively addressed coreand microcode ROM substitution circuits/registers in the microcode patchelements 414.

Now turning to FIG. 7, a block diagram is presented depicting anexemplary format for decompressed microcode register configuration data700 according to the present invention. During a reset sequence,compressed microcode register configuration data is read by each core420 from the physical fuse array 401. The compressed microcode registerconfiguration data is then corrected according to fuse correction dataprovided via bus 412. Then, the corrected compressed microcode registerconfiguration data is decompressed by the register fuses decompressor409. The result of the decompression process is the decompressedmicrocode register configuration data 700. The data 700 comprises aplurality of decompressed data blocks 704 corresponding to the number ofmicrocode registers 415 within the core 420 that require initializationdata. Each decompressed data block 704 comprises a core address field701, a microcode register address field 702, and a microcode registerdata field 703. The sizes of the fields 701-703 are a function of thecore architecture. As part of the decompression process, the registerfuses decompressor 409 creates a complete image of the target datarequired to initialize the microcode registers element 415. Followingdecompression of the microcode register configuration data 700,conventional distribution mechanisms may be employed to distribute thedata 703 to respectively addressed core and microcode registers element415.

Referring now to FIG. 8, a block diagram is presented featuring anexemplary format for decompressed cache correction data 800 according tothe present invention. During a reset sequence, compressed cachecorrection data is read by each core 420 from the physical fuse array401. The compressed cache correction data is then corrected according tofuse correction data provided via bus 412. Then, the correctedcompressed cache correction data is decompressed by the cache fusesdecompressor 410. The result of the decompression process is thedecompressed cache correction data 800. Various cache mechanisms may beemployed in the multi-core processor 330 and the decompressed cachecorrection data 800 is presented in the context of a shared L2 cache334, where all of the cores 332 may access a single cache 334, utilizingshared areas. Accordingly, the exemplary format is provided according tothe noted architecture. The data 800 comprises a plurality ofdecompressed data blocks 804 corresponding to the number of cachecorrection elements 416 within the core 420 that require correctivedata. Each decompressed data block 804 comprises a sub-unit columnaddress field 802 and a replacement column address field 803. As oneskilled in the art will appreciate, memory caches are fabricated withredundant columns (or rows) in sub-units of the caches to allow for afunctional redundant column (or row) in a particular sub-unit to besubstituted for a non-functional column (or row). Thus, the decompressedcache correction data 800 allows for substitution of functional columns(as shown in FIG. 8) for non-functional columns. In addition, as oneskilled in the art will concur, conventional fuse array mechanismsassociated with cache correction include fuses associated with eachsub-unit column that are blown when substitution is required byredundant sub-unit columns. Accordingly, because such a large number offuses are required (to address all sub-units and columns therein), onlya portion of the sub-units are typically covered, and then the resultingconventional cache correction fuses are very sparsely blown. And thepresent inventors note that it is a feature of the present invention toaddress and compress sub-unit column addresses and replacement columnaddresses only for those sub-unit columns that require replacement, thusminimizing the number of fuses that are required to implement cachecorrection data. Consequently, the present invention, as limited byphysical fuse array size and the amount of additional configuration datathat is programmed therein, provides the potential for expanding thenumber of sub-unit columns (or rows) in a cache 334 that can becorrected over that which has heretofore been provided. In theembodiment shown in FIG. 8, it is noted that the associated cores 332are configured such that only one of the cores 332 sharing the L2 cache334 would access and provide the corrective data 802-803 to itsrespective cache correction elements 416. The sizes of the fields802-803 are a function of the core architecture. As part of thedecompression process, the cache correction fuses decompressor 410creates a complete image of the target data required to initialize thecache correction elements 416. Following decompression of the cachecorrection data 800, conventional distribution mechanisms in theresponsible core 332 may be employed to distribute the data 802-803 torespectively addressed cache correction elements 416.

Turning now to FIG. 9, a block diagram is presented showing an exemplaryformat for decompressed fuse correction data 900 according to thepresent invention. As has been discussed above, during reset the fusecorrection decompressor 411 accesses compressed fuse correction data 406within the physical fuse array 401, decompresses the compressed fusecorrection data, and supplies the resulting decompressed fuse correctiondata 900 to the other decompressors 408-410 within the core 420. Thedecompressed fuse correction data comprises one or more end-of-blowfields 901 that indicate the end of successively programming events inthe physical fuse array 401. If a subsequent programming event hasoccurred, a reblow field 902 is programmed to indicate that a followingone or more fuse correction fields 903 indicate fuses within thephysical fuse array 401 that are to be reblown. Each of the fusecorrection fields comprises an address of a specific fuse within thephysical fuse array 401 that is to be reblown along with a state (i.e.,blown or unblown) for the specific fuse. Only those fuses that are to bereblown are provided in the fuse correction blocks fields 903, and eachgroup of fields 903 within a given reblow event is demarcated by anend-of-blow field 901. If reblow field 902, properly encoded, is presentafter a given end-of-blow field 901, then subsequent one or more fusesmay be configured reblown as indicated by corresponding fuse correctionfields. Thus, the present invention provides the capability for asubstantial number of reblows for the same fuse, as limited by arraysize and other data provided therein.

The present inventors have also observed that the real estate and powergains associated with utilization of a shared physical fuse array withinwhich compressed configuration data is stored presents opportunities foradditional features disposed on a multi-core die. In addition, thepresent inventors have noted that, as one skilled in the art willappreciate, present day semiconductor fuse structures often suffer fromseveral shortcomings, one of which is referred to as “growback.”Growback is the reversal of the programming process such that a fusewill, after some time, reconnect after it has been blown, that is, itgoes from a programmed (i.e., blown) state back to an unprogrammed(i.e., unblown) state.

To address growback, and other challenges, the present inventionprovides several advantages, one of which is provision of redundant, yetconfigurable, physical fuse arrays. Accordingly, a configurable,redundant fuse bank mechanism will now be presented with reference toFIG. 10.

Referring to FIG. 10, a block diagram is presented illustratingconfigurable, redundant fuse arrays 1001 in a multi-core device 1000according to the present invention. The multi-core device 1000 includesa plurality of cores 1002 that are configured substantially as describedabove with reference to FIGS. 3-9. In addition, each of the cores 1002includes array control 1003 that is programmed with configuration datawithin a configuration data register 1004. Each of the cores 1002 iscoupled to the redundant fuse arrays 1001.

For purposes of illustration, only four cores 1002 and two physical fusearrays 1001 are shown, however the present inventors note that the noveland inventive concepts according to the present invention can beextended to a plurality of cores 1002 of any number and to more than twophysical fuse arrays 1001.

In operation, each of the cores 1002 receives configuration data withinthe configuration data register 1004 that indicates a specifiedconfiguration for the physical fuse arrays 1001. In one embodiment, thearrays may be configured according to the value of the configurationdata as an aggregate physical fuse array. That is, the size of theaggregate physical fuse array is equal to the sum of the sizes of theindividual physical fuse arrays 1001, and the aggregate physical fusearray may be employed to store substantially more configuration datathan is provided for by a single one of the individual physical fusearrays 1001. Accordingly, the array control 1003 directs itscorresponding core 1002 to read the physical fuse arrays 1001 as anaggregate physical fuse array. In another embodiment, to addressgrowback, according to the value of the configuration data, the physicalfuse arrays 1001 are configured as redundant fuse arrays that areprogrammed with the same configuration data, and the array control 1003within each of the cores 1002 comprises elements that enable thecontents of the two (or more) arrays to be logically OR-ed together sothat if one or more of the blown fuses within a given array 1001exhibits growback, at least one of its corresponding fuses in theremaining arrays 1001 will still be blown. In a fail-safe embodiment,according to the value of the configuration data, one or more of thephysical fuse arrays 1001 may be selectively disabled, and the remainingarrays 1001 enabled for use in either an aggregate configuration or alogically OR-ed configuration. Accordingly, the array control 1003 ineach of the cores 1002 will not access contents of the selectivelydisabled arrays 1001, and will access the remaining arrays according tothe configuration specified by the configuration data in theconfiguration data register 1004.

The configuration data registers 1004 may be programmed by any of anumber of well known means to include programmable fuses, external pinsettings, JTAG programming, and the like.

In another aspect, the present inventors have noted that there may existchallenges when one or more physical fuse arrays are disposed on asingle die that comprises multiple cores which access the arrays. Morespecifically, upon power-up/reset each core in a multi-core processormust read the physical fuse array in a serial fashion. That is, a firstcore reads the array, then a second core, then a third core, and so on.As one skilled in the art will appreciate, compared to other operationsperformed by the core, the reading of a fuse array is exceedingly timeconsuming and, thus, when multiple cores must read the same array, thetime required to do so is roughly the time required for one core to readthe array multiplied by the number of cores on the die. And as oneskilled in the art will appreciate, semiconductor fuses degrade as theyare read and there are lifetime limitations, according to fabricationprocess, for the reading of those fuses to obtain reliable results.Accordingly, another embodiment of the present invention is providedto 1) decrease the amount of time required for all cores to read aphysical fuse array and 2) increase the overall lifetime of the fusearray by decreasing the number of accesses by the cores in a multi-coreprocessor upon power-up/reset.

Attention is now directed to FIG. 11, where a block diagram is presenteddetailing a mechanism according to the present invention for rapidlyloading configuration data into a multi-core device 1100. The device1100 includes a plurality of cores 1102 that are configuredsubstantially as described above with reference to FIGS. 3-10. Inaddition, each of the cores 1102 includes array control 1103 that isprogrammed with load data within a load data register 1104. Each of thecores 1102 are coupled to a physical fuse array 1101 that is configuredas described above with reference to FIGS. 3-10, and to a random accessmemory (RAM) 1105 that is disposed on the same die as the cores 1102,but which is not disposed within any of the cores 1102. Hence, the RAM1105 is referred to as “uncore” RAM 1105.

For purposes of illustration, only four cores 1102 and a single physicalfuse array 1101 are shown, however the present inventors note that thenovel and inventive concepts according to the present invention can beextended to a plurality of cores 1102 of any number and to a pluralityof physical fuse arrays 1101.

In operation, each of the cores 1102 receives load data within the loaddata register 1104 that indicates a specified load order for datacorresponding to the physical fuse array 1101. The value of contents ofthe load register 1104 designates one of the cores 1102 as a “master”core 1102, and the remaining cores as “slave” cores 1102 having a loadorder associated therewith. Accordingly, upon power-up/reset, the arraycontrol 1103 directs the master core 1102 to read the contents of thephysical fuse array 1101 and then to write the contents of the physicalfuse array 1101 to the uncore RAM 1105. If a plurality of physical fusearrays 1101 are disposed on the die, then the uncore RAM 1105 is sizedappropriately to store the contents of the plurality of arrays 1101.After the master core 1102 has written the contents of the physical fusearray 1101 to the uncore RAM 1105, then array control 1103 directs theircorresponding slave cores 1102 to read the fuse array contents from theuncore RAM 1105 in the order specified by contents of the load dataregister 1104.

The load data registers 1104 may be programmed by any of a number ofwell known means to include programmable fuses, external pin settings,JTAG programming, and the like. It is also noted that the embodiment ofFIG. 11 may be employed in conjunction with any of the embodiments ofthe configurable, redundant fuse array mechanism discussed above withreference to FIG. 10.

Now referring to FIG. 12, a block diagram 1200 is presented illustratingan error checking and correction (ECC) mechanism according to thepresent invention. The ECC mechanism may be employed in conjunction withany of the embodiments of the present invention described above withreference to FIGS. 3-11 and provides for another layer of robustness forthe compression and decompression of configuration data. The diagramdepicts a microprocessor core 1220 disposed on a die that is coupled toa physical fuse array 1201 comprising compressed configuration datablocks 1203 as is described above. In addition to the compressedconfiguration data blocks 1203, the array 1201 includes ECC code blocks1202 that each are associated with a corresponding one of the datablocks 1203. In one embodiment, the data blocks 1203 are 64 bits (i.e.,fuses) in size and the ECC code blocks 1202 are 8 bits in size. The core1220 includes a reset controller 1222 that receives a reset signalRESET. The reset controller 1222 has an ECC element 1224 that is coupledto a decompressor 1226 via bus CDATA. The ECC element 1224 is coupled tothe fuse array 1201 via an address bus ADDR, a data bus DATA, and a codebus CODE.

In operation, the physical fuse array 1201 is programmed withconfiguration data in the data blocks 1203 as is described above withreference to FIGS. 3-11. The configuration data corresponding to aparticular data type (e.g., microcode path data, microcode registerdata) is not required to be programmed within the boundaries of a givendata block 1203, but rather may span more than one data block 1203.Furthermore, configuration data corresponding to two or more types ofconfiguration data may be programmed into the same data block 1203. Inaddition, the array 1201 is programmed with ECC codes in the ECC codeblocks 1202 that each result from ECC generation for the data programmedinto a corresponding data block 1203 according to one of a number ofwell known ECC mechanisms including, but not limited to, SECDED HammingECC, Chipkill ECC, and variations of forward error correction (FEC)codes. In one embodiment, the addresses associated with a given datablock 1203 and its corresponding ECC code block 1202 are known. Thus, itis not required that the corresponding ECC code block 1202 be locatedadjacent to the given data block 1203, as is depicted in FIG. 12.

The decompressor 1226 is configured and functions substantially similarto the decompressor 421 described above with reference to FIG. 4, and asallude to with reference to FIGS. 5-11. Upon reset of the core 1220,prior to execution of any of the decompression functions describedabove, the ECC element within the reset controller 1222 accesses thefuse array 1201 to obtain its contents. Addresses associated with givendata blocks 1203 and ECC code blocks 1202 may be obtained via bus ADDR.Compressed configuration data within each of the data blocks 1203 may beobtained via bus DATA. And ECC codes for each of the ECC code blocks1202 may be obtained via bus CODE. As the noted data, addresses, andcodes are obtained, the ECC element 1224 operates to generate ECC checksfor the data retrieved for each data block 1203 according to the ECCmechanism that was employed to generate the ECC code stored in thecorresponding ECC code block 1202. The ECC element 1224 also comparesthe ECC checks with corresponding ECC codes obtained from the array 1201to produce ECC syndromes. The ECC element 1224 further decodes the ECCsyndromes to determine if no error occurred, a correctable erroroccurred, or a non-correctable error occurred. The ECC element 1224moreover operates to correct correctable errors. Correct and correcteddata is then routed to the decompressor 1226 via bus CDATA fordecompression as described above. Non-correctable data is also passed tothe decompressor 1226 via bus CDATA along with an indication of such. Ifan operationally critical portion of the configuration data isdetermined to be non-correctable, the decompressor 1226 may cause thecore 1220 to shut down or otherwise flag the error.

One embodiment contemplates that the ECC element 1224 comprises one ormore microcode routines that are executed to perform the ECC functionsnoted above.

Portions of the present invention and corresponding detailed descriptionare presented in terms of software, or algorithms and symbolicrepresentations of operations on data bits within a computer memory.These descriptions and representations are the ones by which those ofordinary skill in the art effectively convey the substance of their workto others of ordinary skill in the art. An algorithm, as the term isused here, and as it is used generally, is conceived to be aself-consistent sequence of steps leading to a desired result. The stepsare those requiring physical manipulations of physical quantities.Usually, though not necessarily, these quantities take the form ofoptical, electrical, or magnetic signals capable of being stored,transferred, combined, compared, and otherwise manipulated. It hasproven convenient at times, principally for reasons of common usage, torefer to these signals as bits, values, elements, symbols, characters,terms, numbers, or the like.

It should be borne in mind, however, that all of these and similar termsare to be associated with the appropriate physical quantities and aremerely convenient labels applied to these quantities. Unlessspecifically stated otherwise, or as is apparent from the discussion,terms such as “processing” or “computing” or “calculating” or“determining” or “displaying” or the like, refer to the action andprocesses of a computer system, a microprocessor, a central processingunit, or similar electronic computing device, that manipulates andtransforms data represented as physical, electronic quantities withinthe computer system's registers and memories into other data similarlyrepresented as physical quantities within the computer system memoriesor registers or other such information storage, transmission or displaydevices.

Note also that the software implemented aspects of the invention aretypically encoded on some form of program storage medium or implementedover some type of transmission medium. The program storage medium may beelectronic (e.g., read only memory, flash read only memory, electricallyprogrammable read only memory), random access memory magnetic (e.g., afloppy disk or a hard drive) or optical (e.g., a compact disk read onlymemory, or “CD ROM”), and may be read only or random access. Similarly,the transmission medium may be metal traces, twisted wire pairs, coaxialcable, optical fiber, or some other suitable transmission medium knownto the art. The invention is not limited by these aspects of any givenimplementation.

The particular embodiments disclosed above are illustrative only, andthose skilled in the art will appreciate that they can readily use thedisclosed conception and specific embodiments as a basis for designingor modifying other structures for carrying out the same purposes of thepresent invention, and that various changes, substitutions andalterations can be made herein without departing from the scope of theinvention as set forth by the appended claims.

What is claimed is:
 1. An apparatus for providing configuration data toan integrated circuit, the apparatus comprising: a semiconductor fusearray, disposed on a die, into which is programmed the configurationdata, said semiconductor fuse array comprising: a first plurality ofsemiconductor fuses, configured to store compressed cache correctiondata, wherein said first plurality of semiconductor fuses comprises asecond plurality of semiconductor fuses that indicates one or moresub-unit locations within a cache memory that are not to be employedduring normal operation, and wherein said first plurality ofsemiconductor fuses further comprises a third plurality of semiconductorfuses that indicates one or more replacement sub-unit locations withinsaid cache memory that are to be employed during normal operations inreplacement of corresponding ones of said one or more sub-unitlocations; said cache memory, disposed on said die; and a plurality ofcores, disposed on said die, wherein each of said plurality of cores iscoupled to said semiconductor fuse array and said cache memory, and isconfigured to access said semiconductor fuse array upon power-up/reset,to decompress said compressed cache correction data, and to distributedecompressed cache correction data to initialize said cache memory. 2.The apparatus as recited in claim 1, wherein said each of said pluralityof cores decompresses said compressed cache correction data by executingmicrocode during power-up/reset.
 3. The apparatus as recited in claim 1,wherein said sub-unit locations and said replacement sub-unit locationscomprise columns and redundant columns, respectively, within said cachememory.
 4. The apparatus as recited in claim 1, wherein said sub-unitlocations and said replacement sub-unit locations comprise rows andredundant rows, respectively, within said cache memory.
 5. The apparatusas recited in claim 1, wherein the integrated circuit comprises anx86-compatible multi-core microprocessor.
 6. An apparatus for providingconfiguration data to an integrated circuit, the apparatus comprising: amulti-core microprocessor, comprising: a semiconductor fuse array,disposed on a die, into which is programmed the configuration data, saidsemiconductor fuse array comprising: a first plurality of semiconductorfuses, configured to store compressed cache correction data, whereinsaid first plurality of semiconductor fuses comprises a second pluralityof semiconductor fuses that indicates one or more sub-unit locationswithin a cache memory that are not to be employed during normaloperation, and wherein said first plurality of semiconductor fusesfurther comprises a third plurality of semiconductor fuses thatindicates one or more replacement sub-unit locations within said cachememory that are to be employed during normal operation in replacement ofcorresponding ones of said one or more sub-unit locations; said cachememory, disposed on said die; and a plurality of cores, disposed on saiddie, wherein each of said plurality of cores is coupled to saidsemiconductor fuse array and said cache memory, and is configured toaccess said semiconductor fuse array upon power-up/reset, to decompresssaid compressed cache correction data, and to distribute decompressedcache correction data to initialize said cache memory.
 7. The apparatusas recited in claim 6, wherein said each of said plurality of coresdecompresses said compressed cache correction data by executingmicrocode during power-up/reset.
 8. The apparatus as recited in claim 6,wherein said sub-unit locations and said replacement sub-unit locationscomprise columns and redundant columns, respectively, within said cachememory.
 9. The apparatus as recited in claim 6, wherein said sub-unitlocations and said replacement sub-unit locations comprise rows andredundant rows, respectively, within said cache memory.
 10. Theapparatus as recited in claim 6, wherein said multi-core microprocessorcomprises an x86-compatible multi-core microprocessor.
 11. A method forproviding configuration data to an integrated circuit, the methodcomprising: first disposing a semiconductor fuse array on a die, saidfirst disposing comprising: storing compressed cache correction data ina first plurality of semiconductor fuses, wherein the first plurality ofsemiconductor fuses comprises a second plurality of semiconductor fusesthat indicates one or more sub-unit locations within a cache memory thatare not to be employed during normal operation, and wherein the firstplurality of semiconductor fuses further comprises a third plurality ofsemiconductor fuses that indicates one or more replacement sub-unitlocations within said cache memory that are to be employed during normaloperations in replacement of corresponding ones of said one or moresub-unit locations; second disposing the cache memory on the die; andthird disposing a plurality of cores on the die, wherein each of theplurality of cores is coupled to the semiconductor fuse array and thecache memory; via each of the plurality of cores, accessing thesemiconductor fuse array upon power-up/reset, decompressing thecompressed cache correction data, and distributing decompressed cachecorrection data to initialize the cache memory.
 12. The method asrecited in claim 11, wherein the each of the plurality of coresdecompresses the compressed cache correction data by executing microcodeduring power-up/reset.
 13. The method as recited in claim 11, whereinthe sub-unit locations and the replacement sub-unit locations comprisecolumns and redundant columns, respectively, within the cache memory.14. The method as recited in claim 11, wherein the sub-unit locationsand the replacement sub-unit locations comprise rows and redundant rows,respectively, within the cache memory.
 15. The method as recited inclaim 11, wherein the integrated circuit comprises an x86-compatiblemulti-core microprocessor.